Products > Practical > Amkor Technology > CABGA
CABGA ChipArray® Ball Grid Array
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ChipArray® packages are offered in laminate format and are available as Ball Grid Array. The near chip size standard outlines offer fixed body sizes and ball counts. Established SMT mounting processes and techniques are compatibly with ChipArray®. The package size and design provides ideal RF operation (low inductance) for high speed applications requiring small footprints. |
 
Flip Chip
BGA
Variable Pitch/Array Kit
BGA
Fine Pitch Kit |
| Part Number | I/O Count | Pitch | Body Size | Ball Matrix | Ball Alignment | Quantity Per Tray |
| .5mm Pitch | ||||||
| A-CABGA40-.5mm-5mm* | 40 | .5mm | 5mm | 8 x 8 | Perimeter | 624 |
| A-CABGA56-.5mm-6mm* | 56 | .5mm | 6mm | 10 x 10 | Perimeter | 408 |
| A-CABGA84-.5mm-7mm* | 84 | .5mm | 7mm | 12 x 12 | Perimeter | 476 |
| .8mm Pitch | ||||||
| A-CABGA36-.8mm-6mm* | 36 | .8mm | 6mm | 6 x 6 | Full Array | 608 |
| A-CABGA49-.8mm-7mm* | 49 | .8mm | 7mm | 7 x 7 | Full Array | 476 |
| A-CABGA64-.8mm-8mm* | 64 | .8mm | 8mm | 8 x 8 | Full Array | 360 |
| A-CABGA81-.8mm-9mm* | 81 | .8mm | 9mm | 9 x 9 | Full Array | 308 |
| A-CABGA100-.8mm-9mm | 100 | .8mm | 9mm | 10 x10 | Full Array | 308 |
| A-CABGA100-.8mm-10mm* | 100 | .8mm | 10mm | 10 x 10 | Full Array | 250 |
| A-CABGA128-.8mm-11mm* | 128 | .8mm | 11mm | 12 x 12 | Perimeter | 207 |
| A-CABGA144-.8mm-12mm* | 144 | .8mm | 12mm | 13 x 13 | Perimeter | 198 |
| A-CABGA160-.8mm-12mm* | 160 | .8mm | 12mm | 14 x 14 | Perimeter | 198 |
| A-CABGA176-.8mm-13mm* | 176 | .8mm | 13mm | 15 x 15 | Perimeter | 160 |
| A-CABGA192-.8mm-14mm* | 192 | .8mm | 14mm | 16 x 16 | Perimeter | — |
| A-CABGA208-.8mm-15mm* | 208 | .8mm | 15mm | 17 x 17 | Perimeter | 126 |
| A-CABGA224-.8mm-13mm | 224 | .8mm | 13mm | 15 x 15 | Full Array | 160 |
| A-CABGA256-.8mm-17mm* | 256 | .8mm | 17mm | 20 x 20 | Perimeter | — |
| A-CABGA288-.8mm-19mm* | 288 | .8mm | 19mm | 22 x 22 | Perimeter | — |
| 1.0mm Pitch | ||||||
| A-CABGA64-1.0mm-9mm | 64 | 1.0mm | 9mm | 8 x 8 | Full Array | 308 |
| A-CABGA81-1.0mm-10mm | 81 | 1.0mm | 10mm | 9 x 9 | Full Array | 250 |
| A-CABGA100-1.0mm-11mm* | 100 | 1.0mm | 11mm | 10 x 10 | Full Array | 207 |
| A-CABGA121-1.0mm-12mm* | 121 | 1.0mm | 12mm | 11 x 11 | Full Array | 198 |
| A-CABGA144-1.0mm-13mm* | 144 | 1.0mm | 13mm | 12 x 12 | Full Array | 160 |
| A-CABGA169-1.0mm-14mm* | 169 | 1.0mm | 14mm | 13 x 13 | Full Array | — |
| A-CABGA196-1.0mm-15mm* | 196 | 1.0mm | 15mm | 14 x 14 | Full Array | 126 |
| A-CABGA256-1.0mm-17mm* | 256 | 1.0mm | 17mm | 16 x 16 | Full Array | 90 |
See CABGA Drawings and
Solder Information
- * = DC Available.
- Parts are packaged in JEDEC trays when available.
- Some components are available daisy-chained. Call for details.
- <0.12mm (5 mil) coplanarity.
- Solder ball material is Eutectic 63/37 SnPb.
- BT (Bismaleimide-Triazine) substrates or equivalent.
- Package thickness is 1.5mm max for 0.8mm and1.0mm pitch packages.
- Package thickness is 1.34mm max for 0.5mm pitch packages.
- New: CABGA and CTBGA parts are available withoutsolder balls, which makes the package LGA. Please call for more details.
- Lead-free parts are available.