- Heat fused vinyl composite with top and bottom dissipative vinyl layers and conductive
grid mesh inner layer.
Resists delamination; reduces unintended alternative ground paths.
- Conductive grid mesh inner layer.
Provides consistent, reliable, and defined grounding path. Compatible with continuous
monitors.
- Dissipative cushioned vinyl bottom layer.
Provides energy absorption for components susceptible to physical shock like disk
drives.
- Abrasion resistant top layer.
Smooth surface is easy to clean and maintain.
- Compatible with Continuous Monitors.
- Meets working surfaces Rp and Rg requirements of IEC 61340-5-1 paragraph 5.2.
- Antistatic, low tribocharging.
Minimal charge generation on mat.
- High quality material with dissipative electrical properties.
When properly grounded, safely removes electrostatic charges from equipment and
people to protect your ESD sensitive products.
- Non-humidity dependence.
Provides consistent electrical performance regardless of ambient humidity.
- Dimensionally stable.
Minimal shrinkage and curling.
- Lead-free RoHS compliant
- Made in America
Superior Quality
|
 |
