Solder Paste
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NC254 SAC305 - Lead Free, No Clean Solder Paste
Alloy: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Features
- Broad printing process window
- Excellent wetting
- Clear, pin-probe testable residues
- Reduces voiding under MICRO-BGA's
- 24 hour stencil life
- 12-14 hour tack time
NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. NC254 has shown to reduce or eliminate voiding under micro-BGAs. NC254 also offers high humidity tolerance and a chemistry developed for use in air reflow. Slump and humidity tolerances found in NC254 extend the solder pastes useable life in facilities where environmental control is not at its optimum.
Technical Data Sheet: NC 254 SAC305 Solder Paste.pdf
MSDS: NC 254 - SAC305 (Solder Paste - NC).pdf
Available products:
| P/N | Description | Aprox. Weight |
|---|---|---|
| B-LeadFree-35 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 10cc syringe | 35g |
| B-LeadFree-35-10 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 10x10cc syringe | 350g |
| B-LeadFree-35-25 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 25x10cc syringe | 875g |
| B-LeadFree-35-50 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 50x10cc syringe | 1.75 kg |
| B-LeadFree-35-100 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 100x10cc syringe | 3.5kg |
| B-LeadFree-250 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, Jar 250g | 250g |
| B-LeadFree-250-4 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 4 Jars 250g | 1 kg |
| B-LeadFree-500 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, Jar 500g | 500g |
| B-LeadFree-500-2 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 2 Jars 500g | 1 kg |
| B-LeadFree-500-4 | NC 254 SAC305 Lead-Free, No Clean Solder Paste, 4 Jars 500g | 2 kg |